Tedelta took part in Interpack 2026, held in May in Düsseldorf, Germany, further strengthening its position as a leading provider of capping technology for the global packaging industry.
Recognized as the most influential trade fair in the packaging sector worldwide, Interpack brought together thousands of professionals and companies from across the globe. While attendance from Asian markets was somewhat lower than in previous editions, the event remained a key meeting point for industry leaders, manufacturers, and technology providers.
Throughout the exhibition, Tedelta presented its latest capping solutions, engaged with potential customers, manufacturers, agents, and distributors, and explored new opportunities for collaboration with strategic partners across Europe and beyond.
“Interpack is an outstanding platform for connecting with the international market. It has allowed us to showcase our technology to companies we would not have reached otherwise, and the overall outcome has been extremely positive,” said Julia Muñoz, CEO and Export Manager at Tedelta.
Tedelta’s presence in Düsseldorf reflects the company’s ongoing commitment to innovation, technological excellence, and international growth. The company will continue developing high precision capping technology tailored to the specific requirements of a wide range of industries.
